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Proceedings Papers

Electro-Chemical Migration in Aerosol-Jet Printed Electronics Using Temperature-Humidity and Water Droplet Testing Methods

Beihan Zhao, Aniket Ajitkumar Bharamgonda, Eric Jennings, Robert G. Utter, Michael Osterman, Michael H. Azarian, Siddhartha Das, Abhijit Dasgupta, Jason Fleischer, Edwin Quinn, Daniel Hines
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A001, October 25–27, 2022
Paper No: IPACK2022-92306
DOI: https://doi.org/10.1115/IPACK2022-92306
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Topics: Aerosols, Drops, Electronics, Silver, Temperature, Testing, Water
Proceedings Papers

Effect of Corner Staking on the Fatigue Life of BGA Under Thermal Cycling

Deng Yun Chen, Michael Osterman
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, August 29–September 1, 2017
Paper No: IPACK2017-74249
DOI: https://doi.org/10.1115/IPACK2017-74249
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Topics: Ball-Grid-Array packaging, Corners (Structural elements), Fatigue life, Solder joints, Solders, Adhesives, Failure, Materials properties, Stress, Temperature
Proceedings Papers

Effect of Isothermal Aging on Microstructure and Creep Properties of SAC305 Solder: A Micromechanics Approach

Preeti Chauhan, Subhasis Mukherjee, Michael Osterman, Abhijit Dasgupta, Michael Pecht
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A009, July 16–18, 2013
Paper No: IPACK2013-73164
DOI: https://doi.org/10.1115/IPACK2013-73164
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Topics: Creep, Micromechanics (Engineering), Solders, Tin, Nanoscale phenomena, Solder joints, Alloys, Image processing, Intermetallic compounds, Particulate matter
Proceedings Papers

Examination of Solder Interconnects Formed on ENEPIG Finished Printed Wiring Boards Under Drop Loading Conditions

Adam Pearl, Michael Osterman
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A018, July 16–18, 2013
Paper No: IPACK2013-73278
DOI: https://doi.org/10.1115/IPACK2013-73278
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Topics: Printed circuit boards, Solders, Finishes, Failure mechanisms, Lumber, Reliability, Cracking (Materials), Fracture (Process), Resistors, Shock (Mechanics)
Journal Articles

Accelerated Temperature and Voltage Stress Tests of Embedded Planar Capacitors With Epoxy–BaTiO 3 Composite Dielectric

Mohammed A. Alam, Michael H. Azarian, Michael Osterman, Michael Pecht
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. June 2012, 134(2): 021009.
DOI: https://doi.org/10.1115/1.4006704
Published Online: June 11, 2012
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Topics: Capacitance, Capacitors, Failure, Stress, Temperature, Composite materials, Epoxy resins, Failure mechanisms
Proceedings Papers

Prognostics of Embedded Planar Capacitors Under Temperature and Voltage Aging

Mohammed A. Alam, Michael H. Azarian, Michael Osterman, Michael Pecht
Proc. ASME. SMASIS2010, ASME 2010 Conference on Smart Materials, Adaptive Structures and Intelligent Systems, Volume 2, 783-792, September 28–October 1, 2010
Paper No: SMASIS2010-3864
DOI: https://doi.org/10.1115/SMASIS2010-3864
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Topics: Capacitors, Temperature, Failure, Failure mechanisms, Insulation, Capacitance, Laminates, Printed circuit boards, Composite materials, Energy dissipation
Proceedings Papers

Characterization of Lead-Free Solder Interconnects Reliability Under Torsional Loads

Vikram Srinivas, Moustafa Al-Bassyiouni, Michael Osterman, Michael Pecht
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 211-216, November 13–19, 2009
Paper No: IMECE2009-11376
DOI: https://doi.org/10.1115/IMECE2009-11376
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Topics: Lead-free solders, Reliability, Resistors, Stress, Torsion
Proceedings Papers

Physics of Failure Based Virtual Testing of Communications Hardware

Elviz George, Diganta Das, Michael Osterman, Michael Pecht, Christopher Otte
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 191-197, November 13–19, 2009
Paper No: IMECE2009-12181
DOI: https://doi.org/10.1115/IMECE2009-12181
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Topics: Failure, Hardware, Physics, Testing, Design, Simulation, Computer software, Cycles, Reliability, Vibration
Proceedings Papers

Impact of Thermal Aging on the Growth of Cu-Sn Intermetallic Compounds in Pb-Free Solder Joints in 2512 Resistors

Preeti Chauhan, Michael Osterman, Michael Pecht
Proc. ASME. IMECE2009, Volume 5: Electronics and Photonics, 199-210, November 13–19, 2009
Paper No: IMECE2009-10169
DOI: https://doi.org/10.1115/IMECE2009-10169
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Topics: Intermetallic compounds, Lead-free solders, Resistors, Tin, Solders, Temperature, Copper, High temperature, Manufacturing, Reliability
Proceedings Papers

Thermal Performance Measurements of Thermal Interface Materials Using the Laser Flash Method

Vinh Khuu, Michael Osterman, Avram Bar-Cohen, Michael Pecht
Proc. ASME. InterPACK2007, ASME 2007 InterPACK Conference, Volume 1, 405-414, July 8–12, 2007
Paper No: IPACK2007-33554
DOI: https://doi.org/10.1115/IPACK2007-33554
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Topics: Lasers, Heat, Composite materials, Thermal resistance, Acoustics, Adhesives, Algorithms, Cracking (Materials), Delamination, Electronic packages
Journal Articles

Prognostics Assessment of Aluminum Support Structure on a Printed Circuit Board

Sony Mathew, Diganta Das, Michael Osterman, Michael Pecht, Robin Ferebee
Journal: Journal of Electronic Packaging
Article Type: Research Papers
J. Electron. Packag. December 2006, 128(4): 339–345.
DOI: https://doi.org/10.1115/1.2351897
Published Online: January 8, 2006
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Topics: Aluminum, Damage, Life testing, Shock (Mechanics), Stress, Vibration, Testing, Printed circuit boards, Cycles, Failure