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Mohammad Ashraful Haq
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Proceedings Papers

Effects of Mechanical Cycling Induced Damage on the Creep Response of SAC305 Solder

Golam Rakib Mazumder, Mohammad Ashraful Haq, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A002, October 25–27, 2022
Paper No: IPACK2022-93878
DOI: https://doi.org/10.1115/IPACK2022-93878
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Topics: Creep, Damage, Lead-free solders, Solders
Proceedings Papers

Effect of Aging on the Properties of Intermetallic Layers in SAC+Bi Solder Joints

Mohammad Ashraful Haq, Mohd Aminul Hoque, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A011, October 26–28, 2021
Paper No: IPACK2021-73348
DOI: https://doi.org/10.1115/IPACK2021-73348
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Topics: Intermetallic compounds, Lead-free solders, Solder joints, Alloys, Reliability, Copper, Elastic moduli, Electronic packaging, Nanoindentation, Polishing
Proceedings Papers

Effect of Mechanical Cycling at Elevated Temperatures on The Constitutive Properties and Microstructure of Lead Free Solder Alloys

Mohd Aminul Hoque, Mohammad Ashraful Haq, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A014, October 26–28, 2021
Paper No: IPACK2021-73548
DOI: https://doi.org/10.1115/IPACK2021-73548
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Topics: Alloys, Creep, Lead-free solders, Stress-strain curves, Temperature
Proceedings Papers

Determination of Anand Parameters From Creep Testing of SAC305 Solder Joints

Mohammad Ashraful Haq, Mohd Aminul Hoque, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A016, October 27–29, 2020
Paper No: IPACK2020-2690
DOI: https://doi.org/10.1115/IPACK2020-2690
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Topics: Creep, Solder joints, Testing
Proceedings Papers

Study of Lead Free Solder Joints Subjected to Isothermal Mechanical Shear Cycling

Mohd Aminul Hoque, Mohammad Ashraful Haq, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A017, October 27–29, 2020
Paper No: IPACK2020-2692
DOI: https://doi.org/10.1115/IPACK2020-2692
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Topics: Lead-free solders, Recrystallization, Shear (Mechanics)
Proceedings Papers

Effects of Test Temperature and Prior Aging on the Cyclic Stress-Strain Behavior of Lead Free Solders

Mohammad Ashraful Haq, Mohd Aminul Hoque, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A008, October 7–9, 2019
Paper No: IPACK2019-6562
DOI: https://doi.org/10.1115/IPACK2019-6562
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Topics: Lead-free solders, Stress, Temperature