1-15 of 15
Mohammad Tradat
Close
Save search
Follow your search
Access your saved searches in your account
Would you like to receive an alert when new items match your search?
Close Modal
Sort by
Journal Articles

Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers

Pardeep Shahi, Ali Heydari, Bahareh Eslami, Vahideh Radmard, Chandraprakash Hinge, Himanshu Modi, Lochan Sai Reddy Chinthaparthy, Mohammad Tradat, Dereje Agonafer, Jeremy Rodriguez
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041117.
Paper No: EP-24-1030
https://doi.org/10.1115/1.4065948
Published Online: August 17, 2024
View Article titled, Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers
Open the PDF for Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers in another window
Topics: Cooling, Data centers, Flow (Dynamics), Manifolds, Pressure, Pressure drop, Temperature, Modeling, Coolants, Calibration
Journal Articles

Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning

Ali Heydari, Qusai Soud, Mohammad Tradat, Ahmad R. Gharaibeh, Najmeh Fallahtafti, Jeremy Rodriguez, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041106.
Paper No: EP-24-1021
https://doi.org/10.1115/1.4065942
Published Online: July 26, 2024
View Article titled, Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning
Open the PDF for Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning in another window
Topics: Air conditioning, Coolants, Cooling, Temperature, Vehicles, Stress, Heat, HVAC equipment, Noise (Sound), Flow (Dynamics)
Journal Articles

Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks

Ali Heydari, Ahmad R. Gharaibeh, Mohammad Tradat, Qusai Soud, Yaman Manaserh, Vahideh Radmard, Bahareh Eslami, Jeremy Rodriguez, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041102.
Paper No: EP-24-1007
https://doi.org/10.1115/1.4065537
Published Online: June 17, 2024
View Article titled, Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks
Open the PDF for Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks in another window
Topics: Coolants, Cooling, Data centers, Density, Heat, Heat exchangers, Temperature, Fluids, Stress, Cooling systems
Journal Articles

Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multichip Module

Ahmad R. Gharaibeh, Qusai Soud, Yaman Manaserh, Mohammad Tradat, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041101.
Paper No: EP-24-1006
https://doi.org/10.1115/1.4065446
Published Online: May 24, 2024
View Article titled, Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multichip Module
Open the PDF for Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multichip Module in another window
Topics: Computer simulation, Cooling, Flow (Dynamics), Heat, Heat sinks, Multi-chip modules, Pressure drop, Temperature, Fluids, Coolants
Proceedings Papers

Thermal, Hydraulic and Reliability Analysis of Single-Phase Liquid Coolants for Direct-to-Chip Cold Plate Cooling in High-Performance Computing Systems

Pardeep Shahi, Ali Heydari, Chandraprakash Hinge, Lochan Sai Reddy Chinthaparthy, Himanshu Modi, Harold Miyamura, Mohammad Tradat, Uschas Chowdhury, Vahideh Radmard, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-110576
https://doi.org/10.1115/IPACK2023-110576
View Paper titled, Thermal, Hydraulic and Reliability Analysis of Single-Phase Liquid Coolants for Direct-to-Chip Cold Plate Cooling in High-Performance Computing Systems
Open the PDF for Thermal, Hydraulic and Reliability Analysis of Single-Phase Liquid Coolants for Direct-to-Chip Cold Plate Cooling in High-Performance Computing Systems in another window
Topics: Coolants, Cooling, Data centers, Event history analysis, Reliability
Proceedings Papers

At Scale Development of Thermal Test Vehicles for Data Center Liquid Cooling Developments

Ali Heydari, Harold Miyamura, Uschas Chowdhury, Yaman Mohammad Ali Manaserh, Mohammad Tradat, Pardeep Shahi, Vahideh Radmard, Bahareh Eslami, Dwayne Kalma, Jeremy Rodriguez
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111307
https://doi.org/10.1115/IPACK2023-111307
View Paper titled, At Scale Development of Thermal Test Vehicles for Data Center Liquid Cooling Developments
Open the PDF for At Scale Development of Thermal Test Vehicles for Data Center Liquid Cooling Developments in another window
Topics: Cooling, Data centers, Vehicles
Proceedings Papers

Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers

Pardeep Shahi, Ali Heydari, Bahareh Eslami, Vahideh Radmard, Chandraprakash Hinge, Himanshu Modi, Lochan Sai Reddy Chinthaparthy, Mohammad Tradat, Dereje Agonafer, Jeremy Rodriguez
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-110587
https://doi.org/10.1115/IPACK2023-110587
View Paper titled, Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers
Open the PDF for Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers in another window
Topics: Cooling, Data centers, Flow (Dynamics), Manifolds, Modeling
Proceedings Papers

Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multi-Chip Module

Ahmad R. Gharaibeh, Qusai Soud, Yaman Manaserh, Mohammad Tradat, Bahgat Sammakia
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112452
https://doi.org/10.1115/IPACK2023-112452
View Paper titled, Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multi-Chip Module
Open the PDF for Experimental and Numerical Investigation of Single-Phase Liquid Cooling for Heterogeneous Integration Multi-Chip Module in another window
Topics: Cooling, Heat sinks, Multi-chip modules
Proceedings Papers

Performance Analysis of Liquid-to-Air Heat Exchangers of High-Power Density Racks

Ali Heydari, Ahmad R. Gharaibeh, Mohammad Tradat, Qusai Soud, Yaman Manaserh, Vahideh Radmard, Bahareh Eslami, Bahgat Sammakia, Jeremy Rodriguez
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A017, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-112404
https://doi.org/10.1115/IPACK2023-112404
View Paper titled, Performance Analysis of Liquid-to-Air Heat Exchangers of High-Power Density Racks
Open the PDF for Performance Analysis of Liquid-to-Air Heat Exchangers of High-Power Density Racks in another window
Topics: Cooling, Data centers, Density, Heat, Heat exchangers
Proceedings Papers

L2A CDUs Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning

Ali Heydari, Qusai Soud, Mohammad Tradat, Ahmad Gharaibeh, Najmeh Fallahtafti, Jeremy Rodriguez, Bahgat Sammakia
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111564
https://doi.org/10.1115/IPACK2023-111564
View Paper titled, L2A CDUs Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning
Open the PDF for L2A CDUs Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning in another window
Topics: Air conditioning, Cooling, Coolants, Heat, HVAC equipment, Artificial intelligence, Cooling loads, Data centers, Density, Fans
Proceedings Papers

Experimental and CFD Analysis of a Rack Manifold for High Power Density Liquid-Cooled Rack

Pardeep Shahi, Ali Heydari, Pratik Bansode, Ashwin Siddarth, Uschas Chowdhury, Harold Miyamura, Himanshu Modi, Dereje Agonafer, Mohammad Tradat, Jeremy Rodriguez
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A018, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-114351
https://doi.org/10.1115/IPACK2023-114351
View Paper titled, Experimental and CFD Analysis of a Rack Manifold for High Power Density Liquid-Cooled Rack
Open the PDF for Experimental and CFD Analysis of a Rack Manifold for High Power Density Liquid-Cooled Rack in another window
Topics: Computational fluid dynamics, Cooling, Data centers, Flow (Dynamics), Manifolds, Power density
Proceedings Papers

A Comparative Data Center Energy Efficiency and TCO Analysis for Different Cooling Technologies

Ali Heydari, Bahareh Eslami, Uschas Chowdhury, Vahideh Radmard, Pardeep Shahi, Harold Miyamura, Mohammad Tradat, Peter Chen, Drew Tuholski, Kevin Gray, Tyler Buell, Greg Stover, Jeremy Rodriguez
Proc. ASME. InterPACK2023, ASME 2023 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 24–26, 2023
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2023-111959
https://doi.org/10.1115/IPACK2023-111959
View Paper titled, A Comparative Data Center Energy Efficiency and TCO Analysis for Different Cooling Technologies
Open the PDF for A Comparative Data Center Energy Efficiency and TCO Analysis for Different Cooling Technologies in another window
Topics: Cooling, Data centers, Energy efficiency
Journal Articles

A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification

Ghazal Mohsenian, Cong Hiep Hoang, Kourosh Nemati, Hussam Alissa, Mohammad Tradat, Najmeh Fallahtafti, Vahideh Radmard, Bruce Murray, Bahgat Sammakia
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2022, 144(4): 041015.
Paper No: EP-21-1139
https://doi.org/10.1115/1.4053643
Published Online: February 23, 2022
View Article titled, A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification
Open the PDF for A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification in another window
Topics: Air flow, Design, Stress, Flow (Dynamics), Control systems, Heat, Data centers, Inertia (Mechanics)
Proceedings Papers

Liquid Cooling Utilizing a Hybrid Microchannel/Multi-Jet Heat Sink: A Component Level Study of Commercial Product

Cong Hiep Hoang, Mohammad Tradat, Yaman Manaserh, Bharath Ramakrisnan, Srikanth Rangarajan, Yaser Hadad, Scott Schiffres, Bahgat Sammakia
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A008, October 27–29, 2020
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2020-2627
https://doi.org/10.1115/IPACK2020-2627
View Paper titled, Liquid Cooling Utilizing a Hybrid Microchannel/Multi-Jet Heat Sink: A Component Level Study of Commercial Product
Open the PDF for Liquid Cooling Utilizing a Hybrid Microchannel/Multi-Jet Heat Sink: A Component Level Study of Commercial Product in another window
Topics: Cooling, Fins, Heat sinks, Microchannels, Pressure drop, Thermal resistance
Proceedings Papers

Experimental Analysis of Chiller Cooling Failure in a Small Size Data Center Environment Using Wireless Instrumentation

Mohammad Tradat, Bahgat Sammakia, Husam Alissa, Kourosh Nemati
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A006, August 27–30, 2018
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2018-8334
https://doi.org/10.1115/IPACK2018-8334
View Paper titled, Experimental Analysis of Chiller Cooling Failure in a Small Size Data Center Environment Using Wireless Instrumentation
Open the PDF for Experimental Analysis of Chiller Cooling Failure in a Small Size Data Center Environment Using Wireless Instrumentation in another window
Topics: Cooling, Data centers, Experimental analysis, Failure, Instrumentation, Cooling systems, Temperature, Containment, Equipment performance, Pressure