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Journal Articles

The Strength of the Silicon Die in Flip-Chip Assemblies

B. Cotterell, Z. Chen, J.-B. Han, N.-X. Tan
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Papers
J. Electron. Packag. March 2003, 125(1): 114–119.
https://doi.org/10.1115/1.1535934
Published Online: March 14, 2003
View Article titled, The Strength of the Silicon Die in Flip-Chip Assemblies
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Topics: Fracture (Materials), Fracture (Process), Probability, Reliability, Silicon, Stress, Grinding, Flip-chip assemblies