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Journal Articles

Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core

Pratik Bansode, Rohit Suthar, Rabin Bhandari, Akshay Lakshminarayana, Naga Tejesh Eda, Gautam Gupta, Vibin Simon, Himanshu Modi, Vivek Nair, Pardeep Shahi, Satyam Saini, Krishna Bhavana Sivaraju, Dereje Agonafer
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. December 2024, 146(4): 041112.
Paper No: EP-24-1042
https://doi.org/10.1115/1.4066044
Published Online: August 9, 2024
View Article titled, Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core
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Topics: Cooling, Elastic moduli, Fluids, Temperature, Thermomechanics, Heat, Energy dissipation, Glass transition, Data centers, Reliability