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Sohail R. Reddy
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Journal Articles

Effects of Atmospheric Uncertainties on Sonic Boom Perceived Level

Sohail R. Reddy, Janhavi Chitale, George S. Dulikravich
Journal: Journal of Fluids Engineering
Publisher: ASME
Article Type: Research-Article
J. Fluids Eng. April 2021, 143(4): 041504.
Paper No: FE-20-1175
https://doi.org/10.1115/1.4049688
Published Online: February 8, 2021
View Article titled, Effects of Atmospheric Uncertainties on Sonic Boom Perceived Level
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Topics: Aircraft, Loudness (Acoustics), Polynomials, Pressure, Sensitivity analysis, Sonic booms, Temperature, Uncertainty, Wind, Uncertainty quantification
Journal Articles

Bladelets—Winglets on Blades of Wind Turbines: A Multiobjective Design Optimization Study

Sohail R. Reddy, George S. Dulikravich, Helmut Sobieczky, Manuel Gonzalez
Journal: Journal of Solar Energy Engineering
Publisher: ASME
Article Type: Research-Article
J. Sol. Energy Eng. December 2019, 141(6): 061003.
Paper No: SOL-18-1234
https://doi.org/10.1115/1.4043657
Published Online: May 20, 2019
View Article titled, Bladelets—Winglets on Blades of Wind Turbines: A Multiobjective Design Optimization Study
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Topics: Blades, Design, Wind turbines, Optimization, Rotors, Geometry
Proceedings Papers

Bladelets-Winglets on Blades of Wind Turbines: A Multiobjective Design Optimization Study

Sohail R. Reddy, George S. Dulikravich, Helmut Sobieczky
Proc. ASME. IMECE2017, Volume 7: Fluids Engineering, V007T09A078, November 3–9, 2017
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2017-70220
https://doi.org/10.1115/IMECE2017-70220
View Paper titled, Bladelets-Winglets on Blades of Wind Turbines: A Multiobjective Design Optimization Study
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Topics: Blades, Design, Optimization, Wind turbines, Geometry, Computational fluid dynamics, Rotors, Thrust, Algorithms, Flow (Dynamics)
Proceedings Papers

Conjugate Analysis of Thin Film Heat Spreaders to Reduce Temperature at Hot Spots

Sohail R. Reddy, Abas Abdoli, George S. Dulikravich, Rajesh Jha
Proc. ASME. IMECE2015, Volume 8B: Heat Transfer and Thermal Engineering, V08BT10A023, November 13–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2015-52804
https://doi.org/10.1115/IMECE2015-52804
View Paper titled, Conjugate Analysis of Thin Film Heat Spreaders to Reduce Temperature at Hot Spots
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Topics: Flat heat pipes, Temperature, Thin films, Airfoils, Circuits, Coating processes, Coatings, Cross section (Physics), Diamonds, Fins
Proceedings Papers

Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics

Sohail R. Reddy, George S. Dulikravich
Proc. ASME. IMECE2015, Volume 7B: Fluids Engineering Systems and Technologies, V07BT09A053, November 13–19, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IMECE2015-54166
https://doi.org/10.1115/IMECE2015-54166
View Paper titled, Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics
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Topics: Cooling, Electronics, Heat flux, Pareto optimization, Stress, Temperature, Airfoils, Coolants, Cross section (Physics), Deformation
Proceedings Papers

Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics With a Hot Spot

Sohail R. Reddy, Abas Abdoli, George S. Dulikravich, Cesar C. Pacheco, Genesis Vasquez, Rajesh Jha, Marcelo J. Colaco, Helcio R. B. Orlande
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A011, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48242
https://doi.org/10.1115/IPACK2015-48242
View Paper titled, Multi-Objective Optimization of Micro Pin-Fin Arrays for Cooling of High Heat Flux Electronics With a Hot Spot
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Topics: Cooling, Electronics, Heat flux, Pareto optimization, Fins, Stress, Temperature, Design, Shapes, Airfoils
Proceedings Papers

Inverse Design of Cooling of Electronic Chips Subject to Specified Hot Spot Temperature and Coolant Inlet Temperature

Sohail R. Reddy, George S. Dulikravich
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A019, July 6–9, 2015
Publisher: American Society of Mechanical Engineers
Paper No: IPACK2015-48346
https://doi.org/10.1115/IPACK2015-48346
View Paper titled, Inverse Design of Cooling of Electronic Chips Subject to Specified Hot Spot Temperature and Coolant Inlet Temperature
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Topics: Coolants, Cooling, Design, Temperature, Heat, Heat flux, Fluids, Flux (Metallurgy), Airfoils, Computer cooling