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Proceedings Papers

Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 25–27, 2022

Paper No: IPACK2022-97452

DOI: https://doi.org/10.1115/IPACK2022-97452

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Topics: Alloys, Shock (Mechanics), Solders, Vibration, Reliability, Aerospace industry, Climate, Defense industry, Elastic moduli, Electronics

Journal Articles

Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker

J. Electron. Packag. June 2022, 144(2): 021116.

Paper No: EP-21-1062

DOI: https://doi.org/10.1115/1.4053764

Published Online: March 11, 2022

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Topics: Solders, Stress-strain curves, Temperature, Alloys, Operating temperature, Tensile strength, Materials properties

Proceedings Papers

Low Temperature Material Characterization of Lead-Free SAC Solder Alloy at High Strain Rate After Prolonged High Temperature Storage

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A021, October 26–28, 2021

Paper No: IPACK2021-74068

DOI: https://doi.org/10.1115/IPACK2021-74068

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Topics: Alloys, High temperature, Low temperature materials, Solders, Storage

Proceedings Papers

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 27–29, 2020

Paper No: IPACK2020-2658

DOI: https://doi.org/10.1115/IPACK2020-2658

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Topics: Alloys, Temperature, Operating temperature, Solders, Avionics, Constitutive equations, Electronic equipment, Electronics, Energy dissipation, Engines

Journal Articles

Evolution of Anand Parameters With Elevated Temperature Aging for SnAgCu Lead-free Alloys

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker

J. Electron. Packag. June 2021, 143(2): 021005.

Paper No: EP-20-1080

DOI: https://doi.org/10.1115/1.4048181

Published Online: October 8, 2020

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Topics: Alloys, Solders, Temperature, Stress, Solder joints, Operating temperature

Journal Articles

Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements

Pradeep Lall, Tony Thomas, Vikas Yadav, Jinesh Narangaparambil, Wei Liu

J. Electron. Packag. December 2020, 142(4): 041113.

Paper No: EP-20-1037

DOI: https://doi.org/10.1115/1.4047579

Published Online: July 10, 2020

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Topics: Cycles, Failure, Flexible electronics, Modeling, Reliability, Electronics, Regression models, Failure analysis

Proceedings Papers

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A027, October 7–9, 2019

Paper No: IPACK2019-6577

DOI: https://doi.org/10.1115/IPACK2019-6577

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Topics: Alloys, Temperature, Lead-free solders, Solders, Finite element analysis, Avionics, Constitutive equations, Density, Electronic components, Electronics

Proceedings Papers

Acceleration Factors for Flexible Electronics in Wearable Applications From Actual Human Body Measurements

Pradeep Lall, Tony Thomas, Vikas Yadav, Jinesh Narangaparambil, Wei Liu

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A007, October 7–9, 2019

Paper No: IPACK2019-6580

DOI: https://doi.org/10.1115/IPACK2019-6580

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Topics: Flexible electronics, Reliability, Electronics, Failure, Lumber, Modeling, Sensors, Statistical analysis, Testing

Proceedings Papers

Viscoplastic Constitutive Model for High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder After High-Temperature Prolonged Storage

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A005, August 27–30, 2018

Paper No: IPACK2018-8357

DOI: https://doi.org/10.1115/IPACK2018-8357

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Topics: Constitutive equations, High temperature, Lead-free solders, Mechanical properties, Storage, Solders, Alloys, Drilling, Electronics, Geometry

Proceedings Papers

Effect of Alloy Composition and Aging on the Survivability of Leadfree Solders in High Temperature Vibration in Automotive Environments

Pradeep Lall, Vikas Yadav, Di Zhang, Jeff Suhling

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A017, August 29–September 1, 2017

Paper No: IPACK2017-74233

DOI: https://doi.org/10.1115/IPACK2017-74233

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Topics: Alloys, High temperature, Lead-free solders, Vibration, Temperature, Electronics, Vehicles, Solder joints, Solders, Automotive industry

Proceedings Papers

New Method of Flow Maldistribution Mitigation in Parallel Microchannel Heat Sink

Vikas Yadav, Ritunesh Kumar

Proc. ASME. FEDSM2017, Volume 1B, Symposia: Fluid Measurement and Instrumentation; Fluid Dynamics of Wind Energy; Renewable and Sustainable Energy Conversion; Energy and Process Engineering; Microfluidics and Nanofluidics; Development and Applications in Computational Fluid Dynamics; DNS/LES and Hybrid RANS/LES Methods, V01BT10A004, July 30–August 3, 2017

Paper No: FEDSM2017-69084

DOI: https://doi.org/10.1115/FEDSM2017-69084

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Topics: Flow (Dynamics), Heat sinks, Microchannels, Design, Temperature distribution, Cooling, Energy transformation, Finite volume methods, Fluid dynamics, Fluids

Proceedings Papers

A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker

Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A001, July 6–9, 2015

Paper No: IPACK2015-48389

DOI: https://doi.org/10.1115/IPACK2015-48389

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Topics: Alloys, Mechanical properties, Operating temperature, Temperature, Electronic systems, Solders, Vibration, Deformation, Elastic moduli, Electronics

Proceedings Papers

Wavelet Transform for Human Gait With an Asymmetric Load

Cosmin Berceanu, Dan Marghitu, Maruti Ram Gudavalli, P. K. Raju, Vikas Yadav

Proc. ASME. IMECE2014, Volume 3: Biomedical and Biotechnology Engineering, V003T03A061, November 14–20, 2014

Paper No: IMECE2014-39751

DOI: https://doi.org/10.1115/IMECE2014-39751

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Topics: Stress, Wavelet transforms, Wavelets, Cycles, Discrete wavelet transforms, Kinematics, Signals, Students, Weight (Mass)

Proceedings Papers

High Strain-Rate Constitutive Behavior of SAC305 Solder During Operation at High Temperature

Pradeep Lall, Di Zhang, Vikas Yadav

Proc. ASME. IMECE2014, Volume 10: Micro- and Nano-Systems Engineering and Packaging, V010T13A069, November 14–20, 2014

Paper No: IMECE2014-39518

DOI: https://doi.org/10.1115/IMECE2014-39518

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Topics: High temperature, Solders, Temperature, Deformation, Lead-free solders, Alloys, Chemical properties, Constitutive equations, Electronic components, Electronic packaging

Proceedings Papers

Biomechanics of Trunk During Walking Carrying Load on One Hand Using Nonlinear Methods

Vikas Yadav, Maruti Ram Gudavalli, P. K. Raju, Dan Marghitu

Proc. ASME. IMECE2014, Volume 3: Biomedical and Biotechnology Engineering, V003T03A022, November 14–20, 2014

Paper No: IMECE2014-39720

DOI: https://doi.org/10.1115/IMECE2014-39720

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Topics: Biomechanics, Stress, Electromyography, Muscle, Cycles, Dimensions, Entropy, Matlab, Fatigue, Musculoskeletal system

Proceedings Papers

Development of Force-Feedback Technology for Training Clinicians to Deliver Manual Cervical Distraction

Maruti Ram Gudavalli, Vikas Yadav, Robert Vining, Michael Seidman, Stacie Salsbury, Paige Morgenthal, Avinash Patwardhan, Christine Goertz

Proc. ASME. IMECE2013, Volume 3A: Biomedical and Biotechnology Engineering, V03AT03A036, November 15–21, 2013

Paper No: IMECE2013-64509

DOI: https://doi.org/10.1115/IMECE2013-64509

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Topics: Bioengineering, Cervical spine, Computer software, Feedback, Force feedback, Instrumentation, Musculoskeletal system, Patient treatment, Students, Traction

Journal Articles

Probabilistic Approach to Modeling of 3D Objects using Silhouettes

Ankur Jain, Vikas Yadav, Ankush Mittal, Sumit Gupta

J. Comput. Inf. Sci. Eng. December 2006, 6(4): 381–389.

DOI: https://doi.org/10.1115/1.2364206

Published Online: September 16, 2006

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Topics: Algorithms, Construction, Probability, Three-dimensional models, Calibration, Three-dimensional modeling, Noise (Sound)

Journal citation

NARROW

Effect of Property Evolution of Doped and Undoped SnAgCu Solder Alloys Under Shock and Vibration

Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature

Low Temperature Material Characterization of Lead-Free SAC Solder Alloy at High Strain Rate After Prolonged High Temperature Storage

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

Evolution of Anand Parameters With Elevated Temperature Aging for SnAgCu Lead-free Alloys

Acceleration Factor Modeling of Flexible Electronic Substrates From Actual Human Body Measurements

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

Acceleration Factors for Flexible Electronics in Wearable Applications From Actual Human Body Measurements

Viscoplastic Constitutive Model for High Strain Rate Mechanical Properties of SAC-Q Leadfree Solder After High-Temperature Prolonged Storage

Effect of Alloy Composition and Aging on the Survivability of Leadfree Solders in High Temperature Vibration in Automotive Environments

New Method of Flow Maldistribution Mitigation in Parallel Microchannel Heat Sink

A Study on the Evolution of the High Strain Rate Mechanical Properties of SAC105 Leadfree Alloy at High Operating Temperatures

Wavelet Transform for Human Gait With an Asymmetric Load

High Strain-Rate Constitutive Behavior of SAC305 Solder During Operation at High Temperature

Biomechanics of Trunk During Walking Carrying Load on One Hand Using Nonlinear Methods

Development of Force-Feedback Technology for Training Clinicians to Deliver Manual Cervical Distraction

Probabilistic Approach to Modeling of 3D Objects using Silhouettes

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