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Journal Articles

Methodology to Improve the Cylindricity of Engine Cylinder Bore by Honing

Xueping Zhang, Xiaoqing Wang, Daming Wang, Zhenqiang Yao, Lifeng Xi, Xiaojuan Wang
Journal: Journal of Manufacturing Science and Engineering
Article Type: Research-Article
J. Manuf. Sci. Eng. March 2017, 139(3): 031008.
Paper No: MANU-16-1440
DOI: https://doi.org/10.1115/1.4034622
Published Online: October 3, 2016
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Topics: Cylinders, Engine cylinders, Trajectories (Physics), Optimization
Proceedings Papers

A Method to Estimate Residual Stress in Metal Parts Made by Selective Laser Melting

Xiaoqing Wang, Y. Kevin Chou
Proc. ASME. IMECE2015, Volume 2A: Advanced Manufacturing, V02AT02A015, November 13–19, 2015
Paper No: IMECE2015-52386
DOI: https://doi.org/10.1115/IMECE2015-52386
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Topics: Lasers, Melting, Metals, Stress, Residual stresses, Additive manufacturing, Texture (Materials), Alloys, Cooling, Equipment performance
Proceedings Papers

Characterization of Microstructure and Mechanical Property of Inconel 718 From Selective Laser Melting

Xibing Gong, Xiaoqing Wang, Vernon Cole, Zachary Jones, Kenneth Cooper, Kevin Chou
Proc. ASME. MSEC2015, Volume 1: Processing, V001T02A061, June 8–12, 2015
Paper No: MSEC2015-9317
DOI: https://doi.org/10.1115/MSEC2015-9317
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Topics: Lasers, Mechanical properties, Melting, Cooling, Electron backscatter diffraction, Texture (Materials), Nanoindentation, Optical microscopy, Scanning electron microscopes, Young's modulus
Proceedings Papers

Review on Powder-Bed Laser Additive Manufacturing of Inconel 718 Parts

Xiaoqing Wang, Xibing Gong, Kevin Chou
Proc. ASME. MSEC2015, Volume 1: Processing, V001T02A063, June 8–12, 2015
Paper No: MSEC2015-9322
DOI: https://doi.org/10.1115/MSEC2015-9322
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Topics: Additive manufacturing, Lasers, Mechanical properties, Melting
Proceedings Papers

Packaging Friendly Parallel Optical Transceivers

Xiaoqing Wang, Fouad Kiamilev, George Papen, Jeremy Ekman, Ping Gui, Mike Haney, Joseph Deroba, Michael McFadden, Charles Kuznia
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 629-637, July 6–11, 2003
Paper No: IPACK2003-35111
DOI: https://doi.org/10.1115/IPACK2003-35111
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Topics: Cavities, Errors, Lasers, Packaging, Algorithms, Energy consumption, Silicon-on-insulator, Circuit design, Complementary metal oxide semiconductors, Density
Proceedings Papers

Source Synchronous Double Data Rate (DDR) Parallel Optical Interconnects

Ping Gui, Fouad Kiamilev, Xiaoqing Wang, Michael McFadden, Charlie Kuznia, Jeremy Ekman, Joseph Deroba, Michael Haney
Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1, 655-663, July 6–11, 2003
Paper No: IPACK2003-35202
DOI: https://doi.org/10.1115/IPACK2003-35202
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Topics: Optical interconnections, Clocks, Vacuum, Bonding, Cavities, Circuits, Complementary metal oxide semiconductors, Design, Fibers, Flip-chip