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Y. H. Hung
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Proceedings Papers

Proc. ASME. IMECE2001, Heat Transfer: Volume 7 — Heat Transfer in Electronic Equipment, Student Research, and Visualization Techniques, 27-34, November 11–16, 2001
Paper No: IMECE2001/HTD-24374
Proceedings Papers

Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 169-176, July 17–22, 2005
Paper No: IPACK2005-73121
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 63-71, July 6–11, 2003
Paper No: IPACK2003-35018
Proceedings Papers

Proc. ASME. InterPACK2003, 2003 International Electronic Packaging Technical Conference and Exhibition, Volume 2, 73-80, July 6–11, 2003
Paper No: IPACK2003-35020
Proceedings Papers

Proc. ASME. IMECE2004, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 15-22, November 13–19, 2004
Paper No: IMECE2004-59485
Proceedings Papers

Proc. ASME. IMECE2005, Fluids Engineering, 893-900, November 5–11, 2005
Paper No: IMECE2005-80168