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Y. Wei
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Proceedings Papers

Proc. ASME. IMECE2001, Packaging, Reliability and Manufacturing Issues Associated With Electronic and Photonic Products, 243-249, November 11–16, 2001
Paper No: IMECE2001/EPP-24731
Proceedings Papers

Proc. ASME. IMECE2012, Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B, 419-422, November 9–15, 2012
Paper No: IMECE2012-87232
Proceedings Papers

Proc. ASME. PVP2002, New and Emerging Computational Methods: Applications to Fracture, Damage, and Reliability, 187-191, August 5–9, 2002
Paper No: PVP2002-1207
Proceedings Papers

Proc. ASME. IMECE2002, Materials: Processing, Characterization and Modeling of Novel Nano-Engineered and Surface Engineered Materials, 199-205, November 17–22, 2002
Paper No: IMECE2002-39186
Journal Articles
Journal Articles
Journal Articles
Journal Articles
Article Type: Technical Papers
J. Electron. Packag. September 2001, 123(3): 278–283.
Published Online: October 20, 1999
Journal Articles