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Journal Articles

Finite Element Analysis Model-Based Cautious Automatic Optimal Shape Control for Fuselage Assembly

Zhen Zhong, Shancong Mou, Jeffrey H. Hunt, Jianjun Shi
Journal: Journal of Manufacturing Science and Engineering
Article Type: Research Papers
J. Manuf. Sci. Eng. August 2022, 144(8): 081009.
Paper No: MANU-21-1289
DOI: https://doi.org/10.1115/1.4053501
Published Online: February 21, 2022
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Topics: Actuators, Finite element analysis, Manufacturing, Shapes, Algorithms, Stress, Optimization, Simulation
Proceedings Papers

Use Direct Cyclic and Sub-Modeling Approach to Analyze Solder Joint Fatigue Reliability

Tieyu Zheng, Zhen-Zhong Du
Proc. ASME. IMECE2007, Volume 5: Electronics and Photonics, 333-338, November 11–15, 2007
Paper No: IMECE2007-42366
DOI: https://doi.org/10.1115/IMECE2007-42366
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Topics: Fatigue, Modeling, Reliability, Solder joints, Ball-Grid-Array packaging, Crack propagation, Electronic products, Fatigue life, Low cycle fatigue, Packaging
Proceedings Papers

Study on the Response of Flexible Joint Coupled With Unbalanced Rotor

Zhen-Zhong Zhang, Cun-Sheng Zhao, Shi-Jian Zhu
Proc. ASME. IDETC-CIE2005, Volume 1: 20th Biennial Conference on Mechanical Vibration and Noise, Parts A, B, and C, 787-790, September 24–28, 2005
Paper No: DETC2005-84206
DOI: https://doi.org/10.1115/DETC2005-84206
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Topics: Rotors, Dynamic response, Simulation, Stability
Proceedings Papers

Direct Cyclic Method for Solder Joint Reliability Analysis

Zhen-Zhong Du, Jianfeng Wang, Xuejun Fan
Proc. ASME. IMECE2006, Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology, 229-233, November 5–10, 2006
Paper No: IMECE2006-13016
DOI: https://doi.org/10.1115/IMECE2006-13016
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Topics: Event history analysis, Solder joints, Ball-Grid-Array packaging, Electronic packaging, Failure mechanisms, Low cycle fatigue, Simulation, Stress
Proceedings Papers

Optimization Design of Vibration and Shock Isolation System

Cun-Sheng Zhao, Shi-Jian Zhu, Zhen-Zhong Zhang
Proc. ASME. IMECE2006, Noise Control and Acoustics, 99-103, November 5–10, 2006
Paper No: IMECE2006-14035
DOI: https://doi.org/10.1115/IMECE2006-14035
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Topics: Design, Optimization, Shock isolation, Vibration, Shock (Mechanics), Stiffness, Damping, Design methodology, Acoustics, Excitation