With a substantial increase in thermal power density, the operating temperature of high-power light-emitting diodes (LEDs) rises rapidly, exerting a notable effect on chipsets’ performance. A water-cooled microchannel radiator and an air-cooled radiator are proposed to solve this problem. The effects of key factors of both radiators on heat dissipation in a high-power LED chipsets, and general comparisons between each method, are analyzed via Fluent. The simulation results indicate that heat dissipation from the water-cooled microchannel radiator is readily affected by the microchannel’s flow rate and aspect ratio. A larger flow rate and larger aspect ratio favor improved heat dissipation in the water-cooled microchannel radiator. Heat dissipation in the air-cooled radiator is related to volumetric flow rate, rib number, rib height, rib thickness, and substrate thickness. A larger volumetric flow rate, rib number, and rib height favor heat dissipation in the air-cooled radiator. However, there is a critical thickness value: if the thickness is less than the critical value, heat dissipation is greatly affected by rib thickness and substrate thickness, if the thickness is larger than the critical value, the influence is insignificant. The high-power LED chipsets’ temperature is also related to the insulating substrate’ input power and thermal conductivity. A large input power leads to a substantial increase in temperature, and larger thermal conductivity of the insulating substrate minimizes temperature increase in the high-power LED chipsets. When comparing the two radiators, results show an air-cooled radiator should be used in low-power LED chipsets. When an air-cooled radiator cannot satisfy the chipset’s needs, a water-cooled microchannel radiator should be utilized.
Skip Nav Destination
Article navigation
December 2019
Research-Article
Comparative Analysis Between Water-Cooled and Air-Cooled Heat Dissipation in a High-Power Light-Emitting Diode Chipset
Yuanlong Chen,
Yuanlong Chen
School of Mechanical Engineering,
Hefei 230009,
e-mail: chenyuanlong@sina.com
Hefei University of Technology
,Hefei 230009,
China
e-mail: chenyuanlong@sina.com
Search for other works by this author on:
Tingbo Hou,
Tingbo Hou
1
School of Mechanical Engineering,
Hefei 230009,
Hefei University of Technology
,Hefei 230009,
China
;Chemical Science and Engineering College,
Yinchuan 750021,
e-mail: 877717950@qq.com
North Minzu University
,Yinchuan 750021,
China
e-mail: 877717950@qq.com
1Corresponding author.
Search for other works by this author on:
Minqiang Pan
Minqiang Pan
School of Mechanical and Automotive Engineering,
Guangzhou 510640,
e-mail: 1006427@qq.com
South China University of Technology
,Guangzhou 510640,
China
e-mail: 1006427@qq.com
Search for other works by this author on:
Yuanlong Chen
School of Mechanical Engineering,
Hefei 230009,
e-mail: chenyuanlong@sina.com
Hefei University of Technology
,Hefei 230009,
China
e-mail: chenyuanlong@sina.com
Tingbo Hou
School of Mechanical Engineering,
Hefei 230009,
Hefei University of Technology
,Hefei 230009,
China
;Chemical Science and Engineering College,
Yinchuan 750021,
e-mail: 877717950@qq.com
North Minzu University
,Yinchuan 750021,
China
e-mail: 877717950@qq.com
Minqiang Pan
School of Mechanical and Automotive Engineering,
Guangzhou 510640,
e-mail: 1006427@qq.com
South China University of Technology
,Guangzhou 510640,
China
e-mail: 1006427@qq.com
1Corresponding author.
Contributed by the Heat Transfer Division of ASME for publication in the Journal of Thermal Science and Engineering Applications. Manuscript received August 1, 2018; final manuscript received February 18, 2019; published online May 3, 2019. Assoc. Editor: Aaron P. Wemhoff.
J. Thermal Sci. Eng. Appl. Dec 2019, 11(6): 061002 (11 pages)
Published Online: May 3, 2019
Article history
Received:
August 1, 2018
Revision Received:
February 18, 2019
Accepted:
February 18, 2019
Citation
Chen, Y., Hou, T., and Pan, M. (May 3, 2019). "Comparative Analysis Between Water-Cooled and Air-Cooled Heat Dissipation in a High-Power Light-Emitting Diode Chipset." ASME. J. Thermal Sci. Eng. Appl. December 2019; 11(6): 061002. https://doi.org/10.1115/1.4043004
Download citation file:
Get Email Alerts
Cited By
Related Articles
Experimental Investigation of a Flat-Plate Oscillating Heat Pipe With Groove-Enhanced Minichannels
J. Thermal Sci. Eng. Appl (December,2020)
Falling-Film Absorption Around Microchannel Tube Banks
J. Heat Transfer (December,2013)
Flow Boiling Dynamics of Water and Nanofluids in a Single Microchannel at Different Heat Fluxes
J. Heat Transfer (January,2015)
Related Proceedings Papers
Related Chapters
Experiment Investigation of Flow Boiling Process Including Cavitation in Micro-Channel
Inaugural US-EU-China Thermophysics Conference-Renewable Energy 2009 (UECTC 2009 Proceedings)
Effects of Frequency on the Mechanical Response of Two Composite Materials to Fatigue Loads
Fatigue of Composite Materials
Thermocavitation in a Microchannel with a Low Power Light Source
Proceedings of the 10th International Symposium on Cavitation (CAV2018)