The implementation of high power density, multicore central and graphic processing units (CPUs and GPUs) coupled with higher clock rates of the high-end computing hardware requires enhanced cooling technologies able to attend high heat fluxes while meeting strict design constrains associated with system volume and weight. Miniature loop heat pipes (mLHP) emerge as one of the technologies best suited to meet all these demands. Nonetheless, operational problems, such as instable behavior during startup on evaporator side, have stunted the advent of commercialization. This paper investigates experimentally two types of mLHP systems designed for workstation CPUs employing disk shaped and rectangular evaporators, respectively. Since there is a strong demand for miniaturization in commercial applications, emphasis was also placed on physical size during the design stage of the new systems. One of the mLHP system investigated here is demonstrated to have an increased thermal performance at a reduced system weight. Specifically, it is shown that the system can reach a maximum heat transfer rate of 170 W with an overall thermal resistance of 0.12 K/W. The corresponding heat flux is 18.9 W/cm2, approximately 30% higher than that of larger size commercial systems. The studies carried out here also suggest that decreasing the thermal resistance between the heat source and the working fluid and maximizing the area for heat transfer are keys for obtaining an enhanced thermal performance.
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June 2012
Research Papers
Enhanced Miniature Loop Heat Pipe Cooling System for High Power Density Electronics
J. H. Choi,
J. H. Choi
Zalman Tech Co., Ltd.,Seoul, 153-803, South Korea; School of Mechanical Engineering,
Sungkyunkwan University
, Suwon, 440-746, South Korea
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B. H. Sung,
B. H. Sung
School of Mechanical Engineering,
Sungkyunkwan University
, Suwon, 440-746, South Korea
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J. H. Yoo,
J. H. Yoo
Zalman Tech Co., Ltd., Seoul 153-803,
South Korea
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C. J. Kim,
C. J. Kim
School of Mechanical Engineering,
Sungkyunkwan University
, Suwon, 440-746, South Korea
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D.-A. Borca-Tasciuc
D.-A. Borca-Tasciuc
Mechanical, Aerospace, and Nuclear Engineering Department,
Rensselaer Polytechnic Institute
, Troy NY, 12180-3590
Search for other works by this author on:
J. H. Choi
Zalman Tech Co., Ltd.,Seoul, 153-803, South Korea; School of Mechanical Engineering,
Sungkyunkwan University
, Suwon, 440-746, South Korea
B. H. Sung
School of Mechanical Engineering,
Sungkyunkwan University
, Suwon, 440-746, South Korea
J. H. Yoo
Zalman Tech Co., Ltd., Seoul 153-803,
South Korea
C. J. Kim
School of Mechanical Engineering,
Sungkyunkwan University
, Suwon, 440-746, South Korea
D.-A. Borca-Tasciuc
Mechanical, Aerospace, and Nuclear Engineering Department,
Rensselaer Polytechnic Institute
, Troy NY, 12180-3590
J. Thermal Sci. Eng. Appl. Jun 2012, 4(2): 021008 (7 pages)
Published Online: April 20, 2012
Article history
Received:
July 6, 2011
Revised:
November 23, 2011
Published:
April 19, 2012
Online:
April 20, 2012
Citation
Choi, J. H., Sung, B. H., Yoo, J. H., Kim, C. J., and Borca-Tasciuc, D. (April 20, 2012). "Enhanced Miniature Loop Heat Pipe Cooling System for High Power Density Electronics." ASME. J. Thermal Sci. Eng. Appl. June 2012; 4(2): 021008. https://doi.org/10.1115/1.4005734
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