During sawing of silicon wafers for the photovoltaic industry, the variations in temperature will influence the process performance and surface quality of the wafers. To investigate the significance of this effect, the temperature field and heat transfer have been studied experimentally and computationally. Among others, it is found that the temperature typically can increase from 30 °C at the inlet to 65 °C at the outlet of the sawing channel. It is also shown that viscous dissipation is by far the most significant heating source in the process.
Issue Section:
Research Papers
Topics:
Heat transfer,
Sawing,
Semiconductor wafers,
Slurries,
Temperature,
Wire,
Silicon,
Modeling,
Heat
References
1.
Endrös
, A.
, Franke
, D.
, Kaleis
, J.
, Koch
, W.
, and Möller
, H. J.
, 2002, Handbook of Photovoltaic Engineering
, Luque
, A
. and Hegedus
, S.
, eds., Wiley-VCH, Weinheim
, Germany
.2.
Möller
, H. J.
, 2004, “Basic Mechanisms and Models of Multi-Wire Sawing
,” Adv. Eng. Mater.
, 6
(7
), pp. 501
–513
.3.
Wells
, R.
, 1987, “Wire Saw Slicing of Large Diameter Crystals
,” Solid State Technol.
, 30
(September
), pp. 63
–65
.4.
Yamada
, T.
, Fukunaga
, M.
, Ichikawa
, T.
, Furuno
, K.
, Makino
, K.
, and Yokoyama
, A.
, 2002, “Prediction of Warping in Silicon Wafer Slicing With Wire-Saw Machine
,” Theor. Appl. Mech.
, 51
, pp. 251
–258
.5.
Bhagavat
, S.
, and Kao
, I.
, 2008, “A Finite Element Analysis of Temperature Variation in Silicon Wafers During Wiresaw Slicing
,” Int. J. Mach. Tools Manuf.
, 48
, pp. 95
–106
.6.
White
, F. M.
, 1991, Viscous Fluid Flow
, McGraw-Hill
, New York
.7.
Incropera
, F. P.
, and Dewitt
, D. P.
, 1996, Fundamentals of Heat and Mass Transfer
, Wiley & Sons
, Hoboken, NJ
.8.
Bhagavat
, M.
, Prasad
, V.
, and Kao
, I.
, 2000, “Elasto-Hydrodynamic Interaction in the Free Abrasive Wafer Slicing Using a Wiresaw: Modeling and Finite Element Analysis
,” J. Tribol.
, 122
, pp. 394
–404
.9.
Rietzschel
, R.
, Senf
, A.
, Seelmann-Eggebert
, H.-P.
, Kaminski
, S.
, Wagner
, T.
, Funke
, C.
, and Möller
, H. J.
, 2010, “Investigation of Polyglycol Based Slurries for Multi Wire Sawing With Lower Forces and Less Hygroscopicity
,” Proceedings of 25th PVSEC
, Valencia.10.
Rietzschel
, R.
, Wagner
, T.
, Funke
, C.
, and Möller
, H. J.
, 2008, “Optimization of the Wire Sawing Process Using Force—and Temperature—Measurements
,” Proceedings of 23rd PVSEC
, Valencia
.11.
Gnielinski
, V.
, 1975, “Berechnung Mittlerer Wärme- Und Stoffübergangskoeffizienten an Laminar Und Turbulent Überströmten Einzelkörpern Mit Hilfe Einer Einheitlichen Gleichung
,” Forsch. Ingenieurwes.
, 41
, pp. 145
–153
.12.
Daniels
, A.
, 2007, Field Guide to Infrared Systems
, SPIE Press
, Bellingham, WA
.13.
Kaplan
, H.
, 2007, Practical Applications of Infrared Thermal Sensing and Imaging Equipment
, SPIE Press
, Bellingham, WA
.14.
Hecht
, E.
, 1998, Optics
, Addison-Wesley
, Reading, MA.
15.
Johnsen
, L.
, Gastinger
, K.
, Bjerkan
, L.
, Rietzschel
, R.
, and Möller
, H. J.
, 2009, “Absolute Temperature Measurements in Wire Sawing Process
,” Proceedings of 24th PVSEC
, Hamburg.16.
Pallik
, E. D.
, 1985, Handbook of Optical Constants of Solids
, Academic Press
, New York
.17.
Hawkins
, G.
, and Hunneman
, R.
, 2004, “The Temperature-Dependent Spectral Properties of Filter Substrate Materials in the Far-Infrared (6–40 μM)
,” Infrared Phys. Technol.
, 45
, pp. 69
–79
.Copyright © 2012
by American Society of Mechanical Engineers
You do not currently have access to this content.