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Keywords: Electronic cooling
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Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2023, 15(9): 091011.
Paper No: TSEA-22-1438
Published Online: July 27, 2023
... 1 Corresponding author. Email: vikas.lakhera@nirmauni.ac.in Email: atindra.sscssn@ddu.ac.in 18 09 2022 29 06 2023 03 07 2023 27 07 2023 miniature flat heat pipe (FHP) effective thermal conductivity working fluid orientation electronic cooling forced...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2023, 15(9): 091010.
Paper No: TSEA-22-1540
Published Online: July 27, 2023
..., the discharging times at various power levels are more or less the same at a particular orientation. Therefore, the modified Stefan number is used to predict the dimensions of the heat sink based on the charging times required for the electronic cooling application. The Stefan number for all the power inputs...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. October 2023, 15(10): 101004.
Paper No: TSEA-23-1003
Published Online: June 26, 2023
... 2023 15 04 2023 16 04 2023 26 06 2023 aluminum nitride (AlN) HTCC embedded cooling microfluidic microchannel cooler electronic cooling forced convection heat and mass transfer heat transfer enhancement National Natural Science Foundation of China 10.13039...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2023, 15(9): 091005.
Paper No: TSEA-23-1053
Published Online: June 14, 2023
... = density (kg/m 3 ) Φ = thermal leakage (W) downhole electronics vapor compression refrigeration exergy analysis harsh thermal environment thermal management system conduction electronic cooling energy efficiency heat and mass transfer heat transfer enhancement thermal systems...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. August 2023, 15(8): 081009.
Paper No: TSEA-23-1056
Published Online: May 30, 2023
...: rishikesh.pme16@iitp.ac.in 1 Corresponding author. Email: mkkhan@iitp.ac.in Email: mpathak@iitp.ac.in 10 02 2023 06 04 2023 11 04 2023 30 05 2023 thermoelectric cooler electronic cooling phase change material hotspot cooling melting and solidification micro/nanoscale...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2023, 15(6): 061004.
Paper No: TSEA-22-1390
Published Online: April 3, 2023
... conductivity as high as 31,824 W/m°C, which is quite suitable for electronics cooling. Orientation study revealed that horizontal orientation is comparatively better amongst all the other orientations for AGMBHP. Email: anand.bhatt@nirmauni.ac.in 1 Corresponding author. Email: sanjay.jain...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. April 2023, 15(4): 041010.
Paper No: TSEA-22-1451
Published Online: February 27, 2023
... power consumption system efficiency electronic cooling energy efficiency thermal systems National key scientific instrument and equipment development project of China 10.13039/501100012149 2012YQ150256 Proton exchange membrane fuel cells (PEMFC) are considered promising vehicle...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. January 2023, 15(1): 011006.
Paper No: TSEA-22-1170
Published Online: September 22, 2022
... distribution of rotor surface, and (d) axial temperature distribution of stator surface 08 04 2022 30 08 2022 31 08 2022 22 09 2022 permanent magnet synchronous motor gas–liquid two phase jet cooling numerical simulation electronic cooling heat transfer enhancement jets...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. January 2023, 15(1): 011007.
Paper No: TSEA-22-1253
Published Online: September 22, 2022
... channel ANN FEM Galerkin method electronic cooling heat and mass transfer 17 05 2022 30 08 2022 31 08 2022 22 09 2022 1 Corresponding author. Email: baburaoponangi@gmail.com Email: amrutsanjee@gmail.com Email: sachinbharadwaj98@gmail.com References...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2022, 14(12): 121013.
Paper No: TSEA-22-1189
Published Online: September 22, 2022
...@gmail.com 18 04 2022 31 07 2022 04 08 2022 22 09 2022 natural convection method forced convection decoupled method mixed convection shrouded plate finned channel electronic cooling extended surfaces/fins forced convection heat transfer enhancement natural and mixed...
Journal Articles
Yu. E. Nikolaenko, D. V. Pekur, V. Yu. Kravets, V. M. Sorokin, D. V. Kozak, R. S. Melnyk, L. V. Lipnitskyi, A. S. Solomakha
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. December 2022, 14(12): 121001.
Paper No: TSEA-21-1756
Published Online: August 23, 2022
... cooling system thermal characteristics heat sink gravity heat pipe electronic cooling forced convection heat and mass transfer heat exchangers heat pipes heat-transfer enhancement thermal systems Modern radar systems are based on the highly efficient active phased antenna arrays (APAA...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. November 2022, 14(11): 111013.
Paper No: TSEA-22-1109
Published Online: July 18, 2022
... as the system Email: naveen.patil@adypu.edu.in 1 Corresponding author. Email: tapano.hotta@vit.ac.in 04 03 2022 14 06 2022 15 06 2022 18 07 2022 IC chips liquid cold plate heat sink hybrid cooling thermal management electronic cooling energy systems heat...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. September 2022, 14(9): 091018.
Paper No: TSEA-21-1623
Published Online: May 30, 2022
... cryocooler electronic cooling energy systems heat and mass transfer low-temperature heat transfer thermal systems The single-stage Gifford–McMahon (GM) refrigerators are mostly adopted to cool electronic devices, high-temperature superconducting (HTS) magnets of nuclear-powered submarines...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2022, 14(6): 061011.
Paper No: TSEA-21-1144
Published Online: November 18, 2021
...@univ-littoral.fr 04 03 2021 27 10 2021 31 10 2021 18 11 2021 electrocaloric effect solid-state refrigeration heat pump electronic cooling energy efficiency Refrigeration has become an imperative for humankind. Due to the exponential growth of needs for cooling...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. January 2022, 14(1): 011013.
Paper No: TSEA-20-1775
Published Online: November 18, 2021
... transfer enhancement thermal resistance bubble dynamics electronic cooling evaporation experimental techniques extended surfaces/fins two-phase flow and heat transfer Science and Engineering Research Board 10.13039/501100001843 EMR/2015/000498 The recent trend of enhanced...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2022, 14(6): 061013.
Paper No: TSEA-21-1350
Published Online: November 18, 2021
... exchangers and heat sinks are commonly used in many industrial applications that include, but are not limited to, chemical processing, power plants, electronics cooling, and others. Of particular interest for this work are applications of corrugated porous flow through fins for developing air-cooled heat...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. January 2022, 14(1): 011014.
Paper No: TSEA-21-1366
Published Online: November 18, 2021
... insulation panel thermal radiation harsh environment heat flow direction index active thermal management system thermal protection conduction electronic cooling experimental techniques radiative heat transfer Electronics architecture design and its manufacturing trend exhibit a tremendous...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. June 2022, 14(6): 061010.
Paper No: TSEA-21-1236
Published Online: October 13, 2021
... electronics battery system electric vehicle automotive thermal management electronic cooling heat and mass transfer heat pipes heat transfer enhancement porous media Automotive has generic thermal management requirements in different sections, which is increasing in the new-generation energy...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. March 2022, 14(3): 031007.
Paper No: TSEA-21-1156
Published Online: July 26, 2021
... and PCM Volume Fraction ,” Appl. Therm. Eng. , 112 , pp. 143 – 155 . 10.1016/j.applthermaleng.2016.10.090 [14] Ashraf , M. J. , Ali , H. M. , Usman , H. , and Arshad , A. , 2017 , “ Experimental Passive Electronics Cooling: Parametric Investigation of Pin-Fin Geometries...
Journal Articles
Article Type: Research Papers
J. Thermal Sci. Eng. Appl. February 2022, 14(2): 021002.
Paper No: TSEA-21-1006
Published Online: June 18, 2021
.... There are no conflicts of interest. Email: 160100001@iitb.ac.in Email: kshankar@iitb.ac.in 05 01 2021 03 05 2021 05 05 2021 18 06 2021 convective heat transfer flow agitation electronics cooling numerical modeling electronic cooling forced convection heat transfer...
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