... less predictable supply patterns, making the matching of supply and demand more difficult. fault current limiters power electronics power system economics power system protection power system reliability smart power grids thermal management (packaging) 23 03 2011 26 07 2011...

... convection heat conduction pipes thermal management (packaging) thermoelectric devices For heat flux and convection boundary condition of the hot spot, a number of studies have been presented [( 1 )– 15 ]. In this paper, we focus on the isothermal boundary condition on the hot spot...

... Vehicle Power and Propulsion Conference , Dearborn , MI, Sept. 7–10, pp. 609 – 613 . 07 01 2011 27 06 2011 12 08 2011 12 08 2011 cooling thermal management (packaging) thermal resistance thermodynamics thermal management electronics cooling system metrics...

... applications. 08 04 2010 24 01 2011 10 03 2011 10 03 2011 computational fluid dynamics cooling heat pipes power electronics power engineering computing power transformers system recovery thermal management (packaging) The intelligent universal transformer (IUT...

... 18 02 2011 18 02 2011 carbon nanotubes heat transfer nanoparticles phase change materials surfactants suspensions thermal conductivity thermal management (packaging) In the 1990s, it was discovered by Choi and Eastman ( 1 ) that copper nanoparticle suspensions may...

... . The combination of an extremely high-heat flux removal and low device temperatures necessitates the use of refrigeration to maintain satisfactory performance. compressors energy consumption optimisation power control refrigeration thermal management (packaging) thermodynamics 11 09 2009...

... 2010 21 10 2010 21 10 2010 adsorption cooling heat pumps heat recovery thermal management (packaging) thermoelectricity thermoelectric adsorption harsh regenerative zeolite electronics cooling In several industries, application of electronic equipments/sensors...

... using the micro-PIV results. Using a validated CFD model, simulations predict thermal enhancements on the order of 35%. 23 02 2010 17 08 2010 23 09 2010 23 09 2010 computational fluid dynamics cooling flow simulation microchannel flow power electronics thermal management...

... semiconductor devices semiconductor device packaging thermal management (packaging) wick structure heat spreader heat pipe phase change This manuscript is also accepted for publication in the Proceedings of HT2008 of MNHT2009 Micro/Nanoscale Heat Transfer International Conference, Shanghai...

... alumina convection cooling nanofluidics nanoparticles suspensions thermal conductivity thermal management (packaging) two-phase flow viscosity water 18 10 2009 22 01 2010 16 03 2010 16 03 2010 There are no existing empirical correlations for the complex flow...