...Girish R. Desale; Bhupendra K. Gandhi; S. C. Jain Material loss due to erosion is a serious problem associated with the flow of solid-liquid mixtures. In the present work, erosion wear tests have been carried out in a slurry pot tester for seven different ductile type materials namely aluminum...

...A. Abouel-Kasem The effect of particles size and shape on erosion rates and erosion mechanisms of 5117 steels are investigated using slurry whirling-arm ring. Six different sized silica sand particles are used as erodent. These particles are characterized in terms of their average diameter, aspect...

... materials for working elements, improvements in construction, and optimization of the slurry flow are all various ways of softening the consequences of erosion wear that reflects on the working life of the hydraulic transportation pump’s elements. Data, which would be used for acquiring the above mentioned...

...Abouel-Kasem; M. A. Al-Bukhaiti; K. M. Emara; S. M. Ahmed In the present work, the topographical images of slurry erosion surfaces at different impact angles were quantified using fractal analysis. The study showed that the variation of fractal value of slope of linearized power spectral density...

... material removal rate (MRR) was compared with experimental measurements of copper CMP. A series of parametric studies were also conducted in order to predict the effects of varying slurry properties such as solid fraction and abrasive particle size. The results from the model are promising and suggest...

...Elon J. Terrell; C. Fred Higgs III Chemical mechanical polishing (CMP) is a manufacturing process in which a wafer surface is polished by pressing it against a rotating pad that is flooded with slurry. The slurry itself is a fluid containing abrasive particles. Past experimentation has shown...

... of the border as well as in the direction normal to the border of a groove and a plateau are satisfied in order to develop this Reynolds equation. The removal rate model is obtained by taking the concentration of active abrasives in the slurry and the pad grooves into account. Theoretical results are also shown...

... wafer surface hardness, slurry particle size, and slurry concentration. This study also provides physical insights into the interfacial phenomena not discussed by previous models, which ignored the effects of abrasive particles between the polishing interfaces during force balancing. Manuscript...